Flat solderable surface allows tighter placement of surface
mount pads
Hot air solder level alternative
More cost effective than electroless nickel and immersion
gold
We deposit immersion silver on your copper circuitry according
to IPC-4553 which was updated to revision A in June of 2009. The
specification call out a thickness range of 5 - 16 micro-inches.
The nominal thickness of the
deposit will be 8 to 12 micro-inches. Other thickness ranges, up
to 30 micro-inches, are possible though not recommended. The deposit is flat and uniform and has a very long
shelf life. It will withstand multiple heat cycles in assembly, which can be problematic
with traditional organic coatings (OSP).
The process is designed to plate the pads only after solder
mask is applied.
We plate panels that have many different brands of solder mask and do not recommend any
particular brand or model. However, please follow closely any recommendations that your
mask supplier has regarding panel preparation prior to applying the solder mask.
