Hours of operation 7:00 am - 7:00 pm

Finishes Available:

Fully automated 6-8% phosphorous electroless nickel, immersion gold plating line, with panel size capabilities up to 21x25.

Fully Automated electroplated nickel and gold with panel size up to 54 x 36

Six Sulfamate nickel plating baths (low stress) with panel size capabilities of 24x30

Two Soft wire bondable gold plating baths with panel size capabilities of 24x30

Two hard gold plating baths with panel size capabilities of 24x30

Immersion Silver final finish for printed circuits

Copper Sulfate plating for thin film circuits

Quality Assurance

Fisherscope X-ray system, measuring plating thicknesses.

Oxford Instruments CMI900 XRF system to measure plating thickness

Mantis microscope

10X stereo zoom microscope

Chemical Analysis Lab

Atomic Absorption Spectrophotometer.

Ability to perform all chemical analysis related to our processes.

Acid based copper cleaners

Sodium Persulfate microetches

Nickel plating solutions (nickel concentration, boric acid, nickel bromide, pH, hull cells)

Gold plating solutions (gold concentration, pH, nickel contamination)

Sulfuric acid (predip) concentration level, copper levels)

Catalyst (concentration, acid levels, copper levels)