Alternate Finishing meets the industry's most demanding requirements for specialty finishes on printed wiring boards. Our primary specialties include:

ENIG Fully automated 6-8% phosphorous electroless nickel, immersion gold plating line, with panel size capabilities up to 21x25.

ENEPIG (Electroless Nickel, Electroless Palladium and Immersion Gold) same as above with an electroless palladium between the nickel and gold

Nickel Gold Fully Automated electroplated nickel and gold with panel size up to 54 x 36
Sulfamate nickel plating baths (low stress) with panel size capabilities of 24x30
Soft wire bondable gold plating baths with panel size capabilities of 24x30
Hard gold plating baths with panel size capabilities of 24x30

Immersion Silver solderable final finish for printed circuits

Thin Film 
Two Soft wire bondable gold plating baths
Electroless Gold
Copper Sulfate plating

Quality Assurance

Fisherscope X-ray system, measuring plating thicknesses.
Oxford Instruments CMI900 XRF system to measure plating thickness
Oxford Instruments 700 series Beta Backscatter machine to measure thicker gold
10X stereo zoom microscope

Chemical Analysis Lab

Atomic Absorption Spectrophotometer
Ability to perform all chemical analysis related to our processes.
Acid based copper cleaners
Sodium Persulfate microetches
Nickel plating solutions (nickel concentration, boric acid, nickel bromide, pH, hull cells)
Gold plating solutions (gold concentration, pH, nickel contamination)
Sulfuric acid (predip) concentration level, copper levels)
Catalyst (concentration, acid levels, copper levels)
Silver
Copper sulfate plating solution