Flat Solderable Surface which allows tight placement of surface mount devices.
More cost effective than immersion gold
We deposit immersion silver on your copper circuitry according to IPC-4553. Typical silver thickness is 5 - 16 micro-inches. Other thickness ranges, up to 30 micro-inches, are possible.
Recommendations and Limits
We can plate panels up to 24" x 18"
The process is designed to plate the pads only after solder mask is applied.
We plate panels that have many different brands of solder mask and do not recommend any particular brand or model. However, please follow closely any recommendations that your mask supplier has regarding panel preparation prior to applying the solder mask.