Alternate Finishing

Nickel Plate

We provide a low stress satin nickel plated from a sulfamate nickel plating solution. 

 

Nickel plating is a barrier layer which prevents the diffusion of copper into the gold top layer. If the copper is diffused into the gold the electrical characteristics (i.e. contact resistance), corrosion resistance of the contact will be degraded. The nickel layer also prevents the copper layer from physically deforming with repeated insertions of contacts.